Thermal Management


Helping redefine the future of the European space sector

Rhopoint Components, together with its strategic partner ISOCOM, will be exhibiting at Space-Comm Expo Europe. The company will have a wide range of electronic components on display, suitable for use in space and aerospace systems. Many

Rhopoint Components Ltd | 19-02-2026

Natural refrigerant chiller aligns with latest EU F Gas regulation

Tark Thermal Solutions has announced that its EFC2400 natural refrigerant recirculating chiller is engineered to comply with the European Union's latest F‑gas requirements under Regulation (EU) 2024/573 on fluorinated greenhouse gases. By r

Tark Thermal Solutions | 02-02-2026

Blind mate floating mechanism empowers efficient cooling in data centres

Driven by global sustainability targets and the demand for high-performance, energy-efficient infrastructures, new large data centres must achieve their targeted PUE values, accelerating the industry towards large-scale liquid cooling. Howe

Southco | 22-01-2026

Advanced thermoelectric coolers support more accurate PCR and molecular diagnostics

Tark Thermal Solutions has announced that the elongated PCX models of thermoelectric coolers enable narrower temperature zones across PCR trays, allowing for more precise thermal management, faster reaction cycles, and increased sample thro

Tark Thermal Solutions | 11-12-2025

Ultra-junction MOSFET portfolio in SMPD-X package expanded

Littelfuse, Inc. has released the MMIX1T500N20X4 X4-Class Ultra-Junction Power MOSFET. This 200V, 480A N-channel MOSFET features an extremely low on-state resistance (RDS(on)) of just 1.99mΩ, facilitating superior conduction efficiency, sim

Littelfuse | 03-12-2025

New gap filler gel offers very high thermal performance

The Chomerics Division of Parker Hannifin Corporation introduces THERM-A-GAP GEL 120, a one-component, dispensable, thermal interface material with a very high thermal conductivity performance. The 12W/m-K thermal conductivity of this advan

Parker Chomerics | 26-11-2025

Expanded high-accuracy models for shunt resistors

ROHM has expanded its lineup of EROM (Embeddable BCI-ROM) models for shunt resistors and offers them on its website. These models are also now standard in Siemens' electronic thermal design software, Simcenter Flotherm. The company's shu

ROHM Semiconductor | 24-11-2025

Innovative cooling solution for fan-cooled jackets in occupational health and safety

Kyocera will highlight its cooling solution system by airflow technology at A+A in November. Developed in collaboration with BURTLE, the system is designed to improve heat protection and strengthen workplace safety for employees across Euro

Kyocera AVX | 28-10-2025

Reusable temperature data logger for cold chains and shipments

Saelig Company, Inc. now offers the MSR85 Ultralow Temperature Logger, which, due to its replaceable ½ AA 3.6V battery and long operating life, can be employed multiple times as a cost-effective and sustainable solution for cold chain monit

Saelig | 15-10-2025

Micro thermoelectric coolers empower next-gen pluggables for AI data centres

Tark Thermal Solutions has introduced new custom options in the Series of OptoTEC MBX thermoelectric coolers (TECs), engineered to handle emerging thermal challenges in ultra-high-speed optical transceivers that fuel the next wave of AI-dri

Tark Thermal Solutions | 02-10-2025

Highest performance dispensable thermal gel offers vertical tackiness

The Chomerics Division of Parker Hannifin has introduced its new THERM-GAP GEL 75VT, a high-performance dispensable thermal gel offering 7.5W/m-K typical thermal conductivity. The fully cured product performs reliably in vertical and high-v

Parker Chomerics | 25-09-2025

Software combines thermal camera to transform asset condition monitoring tasks

Flir, a Teledyne Technologies company, has introduced the iXX-Series of next-generation app-enabled thermal cameras that are set to transform inspection tasks across a multitude of asset condition monitoring, building inspection, and other

Teledyne FLIR | 19-09-2025

Next-gen compact thermal imaging camera offers faster and more reliable inspections

FLIR, a Teledyne Technologies company, has launched the C8 thermal imaging camera, a new device designed to improve compact thermal diagnostics with high clarity and rapid results. Improvements to the new-generation C8 include improved imag

Teledyne FLIR | 09-09-2025

New non-silicone-based gap fillers deliver high performance

Laird Technologies’ new Tflex SF7 and Tflex SF4 non-silicone-based gap filler materials are high-performance thermal transfer solutions. Each displays outstanding deflection properties, providing minimal pressure on components during assemb

Laird | 28-08-2025


Electropages – Your Guide to Thermal Management Technology News

Electropages provides comprehensive coverage of the latest advancements in thermal management technology. From innovative cooling solutions and thermal gels to high-performance materials for heat dissipation, our platform offers detailed insights into the newest products and technologies in the thermal management sector. We aim to keep professionals and tech enthusiasts informed about the latest trends, product releases, and technological breakthroughs, ensuring they stay at the forefront of the rapidly evolving field of thermal management technology.

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