Sarcina Technology


Pioneering next-generation UCIe-A/S chiplet interconnects for AI systems

Sarcina Technology has revealed the development of patented methodologies for the UCIe-A and UCIe-S protocols. The company's latest innovations include an optimised RDL (redistribu

Semiconductors | 11-09-2025

Advancing photonic package design to address key data centre challenges

Sarcina Technology has reported advances in its photonic package design capabilities for Co-Packaged Optics (CPO), addressing fundamental challenges faced by data centres in dealin

Industrial | 06-06-2025

AI platform enables cost-effective customisable packaging solutions

Sarcina Technology has launched its innovative AI platform to facilitate advanced AI packaging solutions that can be tailored to meet specific customer requirements. Employing ASE'

Semiconductors | 01-04-2025