Power solutions for next-generation 800VDC architecture

ROHM has released a new white paper detailing advanced power solutions for AI data centres based on the novel 800VDC architecture, reinforcing its role as a key semiconductor industry player in driving system innovation.

As part of the collaboration announced in June 2025, the white paper outlines optimal power strategies that support large-scale 800VDC power distribution across AI infrastructure.

The 800VDC architecture represents a highly efficient, scalable power delivery system poised to transform data centre design by enabling gigawatt-scale AI factories. It offers a wide portfolio of power devices, including Si, SiC, and GaN, and is among the few companies globally with the technological expertise to develop analogue ICs (control and power ICs) able to maximise device performance.

Included in the white paper are the company's comprehensive power solutions spanning a wide range of power devices and analogue IC technologies, supported by thermal design simulations, board-level design strategies, and real-world implementation examples.

Download White Paper: CLICK HERE

Key highlights of the white paper:

• Rising Rack Power Consumption: Power demand per rack in AI data centres is rapidly increasing, pushing conventional 48V/12VDC power supply systems to their limits.
• Shift to 800VDC: Transitioning to an 800VDC architecture significantly enhances data centre efficiency, power density, and sustainability.
• Redefined Power Conversion: In the 800VDC system, AC/DC conversion (PSU), traditionally performed within server racks, is relocated to a dedicated power rack.
• Essential Role of SiC and GaN: Wide bandgap devices are critical for achieving efficient performance. By moving AC/DC conversion outside the IT rack, higher-density configurations inside the IT rack can better support GPU integration.
• Optimised Conversion Topologies: Each conversion stage, from AC to 800VDC in the power rack and from 800VDC to lower voltages in the IT rack, requires specialised solutions. The company's SiC and GaN devices contribute to higher efficiency and reduced noise while decreasing the size of peripheral components, significantly increasing power density.
• Breakthrough Device Technologies: The company's EcoSiC series provides industry-leading low on-resistance and top-side cooling modules ideal for AI servers, while the EcoGaN series combines GaN performance with proprietary analogue IC technologies, including Nano Pulse Control. This permits stable gate drive, ultra-fast control, and high-frequency operation–features that have earned strong market recognition.

The shift to 800VDC infrastructure is a collective industry effort. The company is working closely with NVIDIA, data centre operators, and power system designers to deliver essential wide-bandgap semiconductor technologies for next-generation AI infrastructure. Through strategic collaborations, including a 2022 partnership with Delta Electronics, the company continues to drive innovation in SiC and GaN power devices, enabling powerful, sustainable, and energy-efficient data centre solutions.