Next-generation USB 2.0 peripheral controller delivers superior performance and security

Infineon Technologies AG introduces the EZ-USB FX2G3, a next-generation USB 2.0 peripheral controller designed to deliver superior performance, robust security, and advanced power efficiency for USB devices. This new controller builds on the trusted EZ-USB FX2LP platform and provides a highly adaptable solution for industries demanding seamless and secure connectivity.

The demand for efficient and secure data transfer is driving innovation across industries, and USB technology plays a critical role in enabling this connectivity. These controllers include Serial Communication Blocks (SCB), a crypto engine for enhanced security, and a high-bandwidth data subsystem that facilitates DMA data transfers from LVCMOS input to USB output at speeds up to 480Mbps, suitable for USB Hi-Speed-based host systems. A 1024KB SRAM is integrated within the high-bandwidth data subsystem to provide ample buffering for data.

The controller's versatility allows it to seamlessly integrate into a variety of industries. In biometric systems, for example, the device powers secure and fast fingerprint recognition or facial authentication, providing consumers with a convenient and secure way to access their devices. In medical and healthcare devices, the controller drives portable diagnostic tools, imaging systems, and patient monitoring, enabling healthcare professionals to provide more effective and efficient care. In industrial systems, the controller allows real-time data collection and communication in robotics and automation systems, improving productivity and efficiency. In consumer electronics, the controller's speed and efficiency enhance gaming devices, audio peripherals, and other USB accessories, providing consumers with a more enjoyable and immersive experience. In robotics, it supports sensor integration and advanced control, delivering high responsiveness in industrial and consumer designs.

EZ-USB FX2G3 is now available in a 104-pin LGA package with an 8x8 mm footprint. Samples, technical documentation, and support tools are available for evaluation, with high-volume production support.