Next-generation low-density structural polymer for consumer electronics

Syensqo has launched Kalix LD-4850 BK000, a new low-density high-performance polyamide (HPPA) developed to satisfy the evolving demands of the consumer electronics industry.

The polymer enables manufacturers to attain substantial lightweighting of structural components in devices such as smartphones, AR/VR headsets, and other smart electronics. The new grade delivers over 30% weight reduction compared to traditional structural polyamides and polycarbonates, while maintaining excellent mechanical strength and premium surface aesthetics.

Engineered for applications where reduced weight is vital, such as brackets, frames, speaker housings, and AR/VR glass legs, the polymer combines high stiffness and strength with minimal warpage and low dielectric properties. This unique balance supports the development of slimmer, lighter, and more comfortable devices, in line with current hardware trends.

“With Kalix LD-4850, Syensqo is empowering our customers to redefine what’s possible in consumer electronics design,” said Andrew Lau, senior executive vice president of Electronics and Industrial, Syensqo Speciality Polymers Global Business Unit. “By enabling significant weight reduction without sacrificing durability or visual appeal, this new HPPA grade helps manufacturers meet consumer expectations for portability and performance.”

Kalix LD-4850 BK000 is now commercially available globally and has already been adopted by many smartphone manufacturers.