New thick film high power aluminium nitride substrate chip resistors released

Thick film chip resistors on alumina substrates have long dominated the market due to their balance of performance, stability, reliability, and cost. However, alumina's limited thermal conductivity limits the power levels these resistors can achieve.

Stackpole Electronics' new RMAN series overcomes this constraint by employing aluminium nitride substrates, which deliver significantly higher thermal conductivity. This advancement allows substantially greater power handling while maintaining the performance and reliability customers expect from thick film resistor technology.

The RMAN series delivers outstanding power density with the following ratings:

• 2.4W in 1206 package size
• 3.4W in 2512 package size

These power levels are achieved while keeping hot‑spot and terminal temperatures within safe operating limits – a performance difficult to achieve with conventional alumina‑based high‑power chips.