High-performance embedded memory solutions

Rutronik offers KIOXIA's e-MMC memory solutions, a compact and powerful embedded components based on the BiCS FLASH generation 5 TLC 3D flash memory. The e-MMCs are available in 64GB (THGAMSG9T15BAIL_TRAY / THGAMSG9T15BAIL_REEL) and 128GB (THGAMST0T25BAIL_TRAY / THGAMST0T25BAIL_REEL) and support the JEDEC e-MMC 5.1 protocol, operate with an I / O voltage of 1.8V and achieve transfer rates of up to 340MB/s (read) and 230MB/s (write) in HS400 mode. The memory solutions are specified for a wide temperature range from -25C to +85C.

The series combines state-of-the-art BiCS FLASH TLC 3D flash memory technology with an integrated controller and MCP, allowing high data density with low power consumption. The modules are housed in a compact 153-ball BGA package (11.5mm × 13mm, 0.8mm high) and provide full compatibility with existing host systems via the standardised MMC Version 5.1 interface (1-, 4- or 8-bit I / O).

With a read speed of 340MB/s and a write speed of 230MB/s in HS400 mode, the e-MMCs deliver greatly improved performance compared to the fourth generation, with stable operating characteristics even under load and at high temperatures.

Benefits:

• BiCS FLASH generation 5 TLC 3D flash memory
• JEDEC e-MMC 5.1 standard for broad compatibility
• High performance: up to 340MB/s read – 230MB/s write
• Extended temperature range (-25C to +85C)
• Integrated controller with ECC and wear levelling
• Low energy consumption thanks to 1.8V I/O voltage
• Stable performance during continuous operation and temperature changes
• Long-term availability and quality manufacturing from KIOXIA

Application examples include industrial automation and control systems, HMI and edge devices, smart home and IoT applications, digital cameras, wearables, and portable devices.