High-density embedded silicon capacitors advance next-gen AI and HPC performance

Empower Semiconductor, the world leader in powering AI-class processors, today announced the launch of three new embedded silicon capacitors (ECAPs), designed to meet the power integrity demands of next-generation AI and HPC processors. The new ECAP portfolio includes the EC2005P, with 9.34μF capacitance in a 2mm x 2mm package; the EC2025P, offering 18.68μF capacitance in a 4mm x 2mm package; and the EC2006P, providing 36.8μF capacitance in a 4mm x 4mm form factor.

As AI processors push the limits of performance, power delivery has emerged as a crucial constraint. Achieving the necessary power integrity for extreme current densities and ultrafast transient response is no longer realistic with board-level mounted components; embedding capacitors into the processor substrate is now essential. The company’s portfolio is leading the industry initiatives to embed high-density silicon capacitors, unlocking the power integrity required to scale next-generation processor performance.

“Our customers are under intense pressure to deliver greater performance with tighter power margins,” said Steve Hertog, senior vice president of Worldwide Sales, Empower Semiconductor. “These new ECAPs are a proven and practical way to deploy higher capacitance density into a smaller footprint right at the package level of the AI processor.”

The company's new ECAP solutions feature ultralow ESL and ESR. The wide bandwidth ultralow impedance delivers optimal PDN performance and greatly improves overall power integrity. Each device has been engineered from a packaging perspective to meet the strict dimensional and tolerance requirements necessary for embedded deployment within AI and HPC processors.

The EC2005P, EC2025P and EC2006P ECAPs are available in mass production now, supporting the next wave of AI and HPC platform development.