Data Centre


NOR Flash with dual-voltage design optimised for high-speed and low-power SoC applications

GigaDevice has announced the launch of its new generation of high-performance dual-voltage xSPI NOR Flash products – the GD25NX series. Featuring a 1.8V core and 1.2V I/O design, the series connects directly to 1.2V SoCs without an external

GigaDevice | 02-12-2025

SOA MOSFET for AI servers in a compact package launched

ROHM has developed the 100V power MOSFET - RS7P200BM - achieving industry-leading SOA in a 5060-size (5mm × 6mm) package. This product is excellent for hot-swap circuits in AI servers powered by 48V power supplies, as well as for industrial

ROHM Semiconductor | 28-11-2025

High current four-terminal shunt resistors for AI data server power

Stackpole Electronics’ HCSK1216 high-current four-terminal shunt resistor is designed to deliver exceptional accuracy and efficiency in current-sensing applications. The device’s innovative four-terminal design effectively separates supply

Stackpole | 18-11-2025

Industry-first Gen6 DDR5 registered clock driver sets performance benchmark

Renesas Electronics Corporation has delivered the industry’s first sixth-generation RCD for DDR5 RDIMMs. The new RCD is the first to achieve a data rate of 9600MT/s, surpassing the industry standard. This breakthrough marks a notable leap f

Renesas | 18-11-2025

New programmable bulk acoustic wave clocks for 5G, 6G and data centre applications

Skyworks Solutions, Inc. offers a new family of ultra-low-jitter programmable clocks, developed to meet the increasing demands of next-generation connectivity. The SKY63101/02/03 Jitter Attenuating Clocks and SKY69001/02/101 NetSync Clocks

Skyworks | 17-11-2025

Breaking bandwidth barrier with the first 145GHz O/E calibration module

Anritsu Company has released the MN4765B-0140 O/E Reference Calibration Module, the world's fastest and first traceable solution to support the testing demands of next-generation data centres and the explosive growth of AI and ML. As dat

Anritsu | 10-11-2025

DDR5 7200 RDIMM delivers industry-leading reliability for advanced AI workloads

Innodisk has introduced the industry's first DDR5 7200 RDIMM, a major upgrade to its DDR5 series, offering superior performance and the largest 64GB single-module capacity in the industrial market, thereby driving innovation across the embe

Innodisk | 06-11-2025

Breakthrough for AI and electrification with vertical GaN semiconductors

onsemi's vGaN technology is a breakthrough power semiconductor technology that sets a new benchmark for efficiency, power density and ruggedness for the age of AI and electrification. Developed and manufactured at onsemi's fab in Syracuse,

onsemi | 05-11-2025

New GaN-based power supplies feature ultra-compact footprint

Bel Fuse Inc. has introduced two new 65W open-frame AC/DC power supply series to the Bel Power Solutions portfolio. The MDP65, designed for medical applications, and the HDP65, intended for industrial and ITE applications, both utilise GaN

Bel Fuse | 04-11-2025

Highest capacity SOCAMM2 for low-power DRAM in the AI data centre

Micron Technology, Inc. announced customer sampling of 192GB SOCAMM2 to enable wider adoption of low-power memory within AI data centres. The memory extends the capabilities of the company's first-to-market LPDRAM SOCAMM, delivering 50% mor

Micron | 28-10-2025

5kW GaN-based AC/DC reference design for AI server and data centre power supplies

Efficient Power Conversion Corporation (EPC) has announced the availability of a high-efficiency, high-power-density 5kW AC-to-48V DC reference design that demonstrates the full potential of GaN technology for next-generation server and AI

EPC | 28-10-2025

Powering 800V direct current AI data centre architecture with next-gen power semiconductors

Renesas Electronics Corporation has announced that it is supporting efficient power conversion and distribution for the 800V Direct Current power architecture announced by NVIDIA, helping fuel the next wave of smarter, faster AI infrastruct

Renesas | 17-10-2025

GaN technology for next-generation AI data centres

Power Integrations outlines the benefits of its PowiGaN gallium-nitride technology for next-generation AI data centres. The capabilities of 1250V and 1700V PowiGaN technology for 800VDC power architectures are explained in a new white paper

Power Integrations | 16-10-2025

New power-management solutions deliver scalable AI infrastructures

Texas Instruments has debuted new design resources and power-management chips to assist companies in meeting growing AI computing demands and scaling power-management architectures from 12V to 48V to 800VDC. The company is collaborating

Texas Instruments | 16-10-2025