Congatec


COMs deliver efficient entry into rugged embedded edge AI applications

congatec has released a new COM Express 3.1 Type 6 Compact module series. The new conga-TCRP1 modules are based on the latest AMD Ryzen AI Embedded P100 Series processors with four

Industrial | 23-01-2026

COM modules support computationally powerful embedded AI applications

congatec has launched the industry's broadest portfolio of COMs based on Intel Core Ultra Series 3 processors. The new high-performance modules deliver up to 180 TOPS of power-effi

Industrial | 13-01-2026

New COM-HPC mini module opens up new applications

congatec has released its first COM-HPC Mini COM powered by the Qualcomm Dragonwing IQ-X Series processors. The new conga-HPC/mIQ-X with the Qualcomm Oryon CPU delivers outstanding

Industrial | 03-12-2025

Expanded railway testing for COM Express module family

congatec has completed IEC 60068 testing for environmental sustainability – one of the world's most rigorous testing for extreme environmental conditions – for the conga-TC675r COM

Semiconductors | 24-10-2025

New COM Express compact module offers unrivalled AI performance

congatec boosts AI performance for medical, robotics, industrial, retail, and gaming applications, delivering up to 99 TOPS. This excellent AI performance is driven by the new cong

Industrial | 18-03-2025

Application-ready software building blocks for simple and fast IoT connectivity

congatec expands the application-ready functionality of aReady.COM with aReady.IOT, presenting powerful software building blocks for secure IoT connectivity from the COM to the clo

Industrial | 07-02-2025

New COMs deliver performance boost with Intel Core S technology

congatec has extended its portfolio of high-performance COM-HPC COMs with the conga-HPC/cBLS, specially developed for power-hungry edge and infrastructure applications. The new COM

Test & Measurement | 14-01-2025

AI and graphics performance expanded for low-power SMARC modules

congatec is updating its conga-SA8 SMARC modules: The low-power COMs are now available with the latest Intel Core 3 processor generation. This new CPU technology delivers a signifi

Industrial | 10-01-2025

Compact module for high-performance AI applications at the edge

congatec has introduced new COM Express Compact COMs with AMD Ryzen Embedded 8000 Series processors. Based on the dedicated computing cores of the new Ryzen processors, which featu

Industrial | 20-09-2024

New SMARC modules set new benchmarks for secure edge AI applications

congatec has released new high-performance COMs with i.MX 95 processors from NXP that expand its extensive module portfolio with low-power NXP i.MX Arm processors. In doing so, it

Industrial | 12-07-2024

New 3.5" application carrier board for COM-HPC Mini modules

congatec offers the first board-level product in line with its recently introduced aReady. strategy. Application-ready for immediate deployment in industrial use cases, the new 3.5

Industrial | 24-04-2024

Fitting COMs with everything that application developers need

Congatec has launched a new product family, aReady.COM, which is the first key stage of its innovative aReady. strategy, which delivers a significantly smoother implementation of e

Industrial | 19-03-2024

New high-performance COM's integrated IIoT capabilities create added value

congatec is showcasing numerous new COMs at embedded world. These innovations include new Intel Core Ultra processor-based modules with integrated AI, and premieres based on innova

Industrial | 20-02-2024